Mijing Z20 Pro / Max X-17PM Middle Layer Planting Tin Platform

Mijing Z20 Max Motherboard Middle Layer Planting Tin Platform for iPhone X to 17Pro Max

Features:

• Mijing Z20Max Motherboard Middle Layer BGA Reballing Stencil Platform Jig Fixture is a professional BGA Reballing Stencil Fixture for iPhone X/XR/XS/XS Max/11/11 Pro/11Pro Max/12/12 Mini/12 Pro/12Pro Max/13/13 Mini/13 Pro/13Pro Max/14/14 Plus/14 Pro/14Pro Max/15/15 Plus/15 Pro/15Pro Max/16e/16/16 Plus/16 Pro/16Pro Max/17/Air/17 Pro/17Pro Max, convenient and faster for reballing BGA without any damage, offer you the best solution for BGA reballing and repairing

How to use:

• Install the main board on the platform
• Cover the BGA reballing stencil on the mainboard
• Evenly spread tin on the cover of the reballing stencil
• Remove the reballing stencil cover
• Take out the motherboard and cooperate with the hot air gun to solidify the tin point