LB Tool Hand-Polished Blades for Mobile Phone Prying / Degumming / Motherboard Delamination
Features:
- Hand-Polished Blades: Meticulously crafted for superior sharpness and precision
- Premium Alloy Material: High hardness, strong toughness, and resistance to deformation
- Temperature Resistance: Withstands temperatures from -20°C to 450°C, ensuring reliability under intense conditions
- Corrosion-Resistant: Engineered for longevity even in harsh environments
- Versatile Designs: Multiple blade types (I, II, III, IV, V) tailored for specific repair scenarios
Blade Models & Functions:
- Model I (Straight Cutter): Pry the IC CPU to remove the glue
- Model II (Corner Blade): Ideal for scraping adhesive around IC edges.
- Model III (Special-Shaped Cutting Blade): Designed for precise glue cutting in complex areas.
- Model IV (Straight Cutter): Pry CPU and layer it
- Model V (Prying Blade): Perfect for lifting ICs and hard drives without damage.
Applications:
- Cutting black glue and edge adhesive
- Removing glue from motherboard ICs/CPUs
- Prying out CPUs, ICs, and hard drives with precision
Package includes:
- 3 x Blades
