2uul BH17 CPU REBALL BASE Magnetic Dual-Sided BGA Reballing Platform Set for iPhone / Android
Package includes:
- 1 x Magnetic Base
- 75 x Stencil :
Qualcomm (x17)
- SM8750
- SM8450 (Snapdragon 8 Gen1)
- SM8150 (Snapdragon 855)
- SM7325 (Snapdragon 778G)
- SM7125 (Snapdragon 720G)
- SM8650 (Snapdragon 8 Gen3)
- SM8350 (Snapdragon 888/888 Plus)
- SM7550 (Snapdragon 7 Gen3)
- SM7250 (Snapdragon 765G)
- SM8550 (Snapdragon 8 Gen2)
- SM7150 (Snapdragon 730G)
- SM7450 (Snapdragon 7 Gen1)
- SM8475 / SM7475 (Snapdragon 8+ Gen1 / 7+ Gen2)
- SM8250-100 (Snapdragon 865 Gen2)
- SM7350 (Snapdragon 778G/775)
- SM8250-002 (Snapdragon 865/870 A/K)
- SM7225-00AB (Snapdragon 750G)
Exynos (x11)
- Exynos 2200
- Exynos 9820
- Exynos 8895
- Exynos 1330 – E8535P
- Exynos 1380 – E8835P
- Exynos 9815 / 1080
- Exynos 2100
- Exynos 980
- Exynos 1480 – E8845
- Exynos 990
- Exynos 1280 – E8825
Apple A-Series (x12)
- A19 Pro
- A19
- A18 Pro
- A18
- A17
- A16
- A15
- A14
- A13
- A12
- A11
- A10
MTK (MediaTek) (x14)
- MT6989W (Dimensity 9300)
- MT6895Z (Dimensity 8100)
- MT6855V (Dimensity 830)
- MT6853V (Dimensity 720)
- MT6983Z (Dimensity 9000)
- MT6885Z (Dimensity 1000)
- MT6873V / 6875V (Dimensity 800/820)
- MT6891Z / 6893Z (Dimensity 1100/1200)
- MT6985W (Dimensity 9200)
- MT6987Z (Dimensity 9300 Ultra)
- MT6877V (Dimensity 900)
- MT8781 / MT6789V
- MT6761V / 6762V / 6765
- MT6833V (Dimensity 810)
HiSilicon (Kirin) (x9)
- Hi3660 (Kirin 960)
- Hi3690-5G (Kirin 990-5G)
- Hi3690-5G (second listing, also Kirin 990-5G)
- Hi6280 (Kirin 810)
- Hi36A0 (Kirin 9000)
- Hi36A0 (second listing, Kirin 9000s)
- Hi3690-4G (Kirin 990-4G)
- Hi3680 (Kirin 985)
- Hi6290 / L (Kirin 820 / 820E)
- Hi3670 (Kirin 970)
- (Note: Some appear duplicated but are listed separately in the image.)
EMMC + RAM (x12)
- BGA 254小
- BGA 169
- BGA 134
- BGA 436 (CPU 上板)
- BGA 178小
- BGA 153
- BGA 186
- BGA 162
- BGA 556 (CPU 上板)
- BGA 37C (CPU 上板)
- BGA 496 (CPU 上板)
- BGA 221 (CPU 上板)
