Sunshine SS-T12B Universal Intelligent Motherboard Heating Platform for Android & iPhone 7 to 15PM

Features:
SS-T12B Multi-functional universal intelligent maintenance heating Platform, support Android + iPhone series / Upgradable and expandable design / Safe and fast layered fit / No air gun soldering iron
Supports bonding and separation of Android and iPhone 7G to 15Pro Max motherboards, separation of screen frames, etc., and will continue to be updated in the future
Precise temperature control / Smart digital display / Rapid heating / Unlimited expansion
Modular design, a variety of combined modules, common modules on the base, good scalability, easy-to-expand new modules
The heating area is large, the compatibility is good, and it supports the desoldering operation of various motherboard components, which is more convenient and quick
Intelligent temperature control, customized temperature adjustment according to different melting points, with fast heating, long life, and uniform temperature
Supports bonding and separation of Android and iPhone 7G to 15Pro Max motherboards, separation of the screen frame, etc., fast and accurate layering, tin planting, glue removal, and bonding of motherboards, etc
360° rotating buckle + guide rail design, suitable for precise clamping of motherboards of different shapes, improving maintenance efficiency
Module quick-release buckle, easy to take out and put in. (Note: before replacing the module after heating, be careful of residual heat burns)
Precise positioning, the module is equipped with a positioning column, which can be accurately separated and attached to the main board, and is easy to take
Heat dissipation and anti-slip design, hollow heat dissipation design, high-temperature resistance; Silicone wear-resistant foot pads, stable operation, good anti-skid effect

The Modules used for:
T12B-IP1: Common for most models of screen bracket separation/fingerprint repair/CPU chip degumming/face repair
T12B-IP2: Fingerprint repair/A12/A11/X/XS/XSM motherboard delamination
T12B-IP3: iPhone 11/11P/11PM/A13 motherboard layering
T12B-IP4: CPU chip degumming/12/12Mini/12P/12PM motherboard layering
T12B-IP5: iPhone 13/13Mini/13P/13PM/A15 motherboard layering
T12B-IP6: iPhone 14/14Plus/14P/14PM/A15/A16 motherboard layering
T12B-IP7: iPhone X/XR/XS/XSM/12P/12PM/13/13Mini camera
T12B-IP8: iPhone 11/11P/11PM/13P/13PM camera
T12B-IP9: iPhone 7G/7P/8G/8P/11/12/12Min/14/14Plus/14P/14PM camera
T12B-IP10: Android universal
T12B-lP11: iPhone 15/15Plus/15P/15PM/A16/A17 motherboard layering

Package includes:
1 x Host
10 x Module
1 x Power Cable